description the following cumulative test results have been obtained from testing performed at avago technologies in accord - ance with the latest revision of mil- std-883. avago tests parts at the absolute maximum rated con - ditions recommended for the device. the actual per - formance you obtain from avago parts depends on the electrical and environmental characteristics of your ap - plication but will probably be better than the perform - ance outlined in table . test name stress test conditions total device hrs. units tested total failed point typical performance mtbf failure rate (% /1k hours) high temperature operating life v cc = 5.5 v, v a = v b = 3.5 v t a = 00c 000 hours ,405,000 ,405 2 702,500 0.42 temperature humidity operating life v cc = 5.5 v v a = v b = 3.5 v ,000 hours t a = 85c rh = 85% ,495,000 ,495 0 49,500 0.669 table 1. life tests demonstrated performance failure rate prediction the failure rate of semiconductor devices is determined by the junction temperature of the device. the relation - ship between ambient temperature and actual junction temperature is given by the following: t j (c) = t a (c) + ja p avg where t a = ambient temperature in c ja = thermal resistance of junction-to-ambient in c/watt p avg = average power dissipated in watts the estimated mtbf and failure rate at temperatures lower than the actual stress temperature can be deter - mined by using an arrhenius model for temperature ac - celeration. results of such calculations are shown in the table on the following page using an activation energy of 0.43 ev (reference mil-hdbk-2 7). heds-5500, HEDS-6500 and heds-9000, 9100, 9200 series motion sensing products, optical encoder modules reliability data
2 table 2. ambient temperature (c) junction temperature (c) point typical performance [1] in time performance in time [2] (90% confdence) mtbf [1] failure rate (%/1k hours) mtbf [2] failure rate (%/1k hours) +00 +0 703,000 0.42 264,000 0.379 +90 +00 996,000 0.00 374,000 0.267 +80 +90 ,440,000 0.069 54,000 0.85 +70 +80 2,26,000 0.047 799,000 0.25 +60 +70 3,20,000 0.03 ,206,000 0.083 +50 +60 4,968,000 0.020 ,867,000 0.054 +40 +50 7,90,000 0.03 2,969,000 0.034 +30 +40 2,942,000 0.008 4,863,000 0.02 +20 +30 2,903,000 0.005 8,230,000 0.02 notes: . the point typical mtbf (which represents 60% confdence level) is the total device hours divided by the number of failures. in the case of zero failures, one failure is assumed for this calculation. 2. the 90% confdence mtbf represents the minimum level of reliability performance which is expected from 90% of all samples. this confdence interval is based on the statistics of the distribution of failures. the assumed distribution of failures is exponential. this particular distribution is commonly used in describing useful life failures. refer to mil-std-690b for details on this methodology. 3. failures are catastrophic or parametric. catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures are failures to meet an electrical characteristic as specifed in product catalog such as output voltage, duty or state errors. example of failure rate calculation assume a device operating 8 hours/day, 5 days/week. the utilization factor, given 68 hours/week is: (8 hours/day) x (5 days/week) / ( 68 hours/week) = 0.25 the point failure rate per year (8760 hours) at 50c ambient temperature is: (0.020% / k hours) x 0.25 x (8760 hours/year) = 0.044% per year similarly, 90% confdence level failure rate per year at 50c: (0.054% / k hours) x 0.25 x (8760 hours/year) = 0. 8% per year
3 test name mil-std-883c reference test conditions units tested units failed esd - human body model 305.2 .5 k ? , 00 pf, 5 positive and 5 negative dis - charges per pin. v z = 3.0 kv 35 0 table 3. environmental tests table 4. mechanical tests table 5. electrical tests test name mil-std-883c reference test conditions units tested units failed temperature cycle 00 -40c to + 00c, 5 minute dwell, 5 minute transfer, 5 cycles 200 cycles 500 cycles 9,52 ,570 ,570 0 3 9 solder heat resistance 2003 sn/pb 60/40 solder; 260c peak; 0 sec., 20 temp cycles @ -40c to 85c 38 0 high temperature n/a t a = +05c 77 0 storage life 2,000 hours test name mil-std-883c reference test conditions units tested units failed mechanical shock 2002 5 blows; x, y, z axes, 500 g, 0.5 msec. 5 0 vibration variable frequency 2007 3 cycles, 4 min. each x, y, z axes, 20 g min. 20 to 2000 hz 5 to 000 hz 26 0 0 0 terminal strength 2004 condition a lb. for 30 seconds 5 0 lead fatigue 2004, cond. b 3 bends, 5 minimum 5 0
4 for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5965-2775e 5965-9642e - december 11, 2006
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